HANMI Semiconductor completes 4th plant in 1H

HANMI Semiconductor, a company specializing in semiconductor equipment, will complete its fourth Plant in Gajwa-dong, Seo-gu, Incheon in the first half of this year. This is to meet the growing demand for equipment. HANMI Semiconductor will have a total production capacity of 13,000 pyeong after the completion of Plant 4, in addition to the existing Plants 1 to 3. The company says it will be able to produce and test up to 300 semiconductor devices at once.

Kim Min-hyun, CEO of HANMI Semiconductor, said, "This year, HANMI Semiconductor has been experiencing uncertainties in earnings due to the decline in demand for memory semiconductors and the US-China trade war. However, HANMI Semiconductor has been focusing on core equipment such as Vision Placement and Flip Chip Bonder, while expecting higher sales of newly developed equipment such as Through Silicon Via (TSV) Dual Stacking thermal compression (TC) Bonder. In addition, with the ongoing development of new equipment with major semiconductor customers, our business is expected to prosper this year as well."

Semicon Korea 2019 exhibition will focus on 6th generation Vision Placement equipment, which has been ranked number one in the world market share for 14 consecutive years since 2004. The equipment performs cleaning, drying, inspection, and sorting of semiconductor packages cut from the wafer. To date, more than 1,800 units have been sold to the world's leading semiconductor manufacturers from the first-generation model released in 1998 to the present.

TSV dual stacking TC bonders are used in high bandwidth memory (HBM) memory fabrication utilizing TSV technology. TSV is a state-of-the-art deposition technique in which very fine holes are made in a chip, the same chip is stacked vertically, and the hole is filled with copper to form an electrode. HANMI Semiconductor TC bonders are used to precisely stack individual Die with holes on the finished wafer. It is called thermal compression bonder because it is compressed by heat and the chip is raised. The device is structured to incorporate two bonding heads, achieving structural innovation. Compared to competitors' products, it has doubled productivity.

CEO Kim said, "We will endeavor to become a mid-range equipment company that provides customers with the most value they need through continuous investment."