SK Hynix succeeds in developing die bonder 

SK Hynix and Hanwha Precision Machinery has developed a die bonder used in the back-end of semiconductor production.

Die bonders bonds the chip die to the printed circuit board. It is one of the most sophisticated equipment used in chip production lines.

South Korean companies has relied on Japanese suppliers for the bonders.

Hanwha applies its own readjustment technology on the bonder to improve the replacement time. The bonder has an air lift device that can pick up 25 micrometers-thin semiconductor dies, which was developed by SK Hynix. SK Hynix also improved the defect rate of the bonders.

The bonder received the IR52 award from the Ministry of Science and ICT, which is given to technology that contribute to South Korean industry.