PI and SK supplies CoF material for Galaxy A smartphones

PI Advanced Materials and SK Nexilis are supplying materials used for chip on film (CoF) in Samsung’s Galaxy A smartphones, TheElec has learned.

PI Advanced Materials is supplying the polyimide film for the CoF, while SK Nexilis is providing flexible copper clad laminate (FCCL).

It marks the first time that the pair is supplying the key materials for CoF.

Samsung has previously procured them from Japanese companies.

CoF is a film that connects the display panel with the flexible printed circuit board. It is where the display driver IC is installed. 

FCCL is made by sputtering the copper on the polyimide film. Circuits are drawn on the FCCL where the display driver is attached.

Samsung is using CoF for higher tier Galaxy A models.

The actual CoF is assembled by LG InnoTek.

These South Korean companies has been developing CoF and related materials since Japan’s export ban against South Korean in 2019. They have been working to develop the materials and gain customer approval for a year since then.

LG InnoTek is planning to supply tens of millions of CoF for use in Galaxy A52 and A72 this year. Samsung has previously used CoF of Japan’s Toray Industries and Stemco, a joint venture between Toray (70% stake) and Samsung Electro-Mechanics (30% stake).

Besides CoF, display driver ICs can be installed on display panels through chip on plastic (CoP) or chip on glass (CoG). Display driver IC are installed in different places and the way the display panel substrate and FPCB are connected differ for each method.

Samsung uses CoP for its flagship smartphones, where the display driver IC are embedded on the polyimide substrate of the OLED panel. Lower tier Galaxy A models and Galaxy M series use CoG.