Samsung announces update chip packaging for HBMs

Samsung said on Thursday that it has developed a new chip packaging technology.

Called Interposer-Cube4, or I-Cube4, it places four high bandwidth memory dies and one logic dies in one package

It is the latest version in Samsung’s I-Cube technology, which horizontally places logic dies such as CPU and GPU and several high bandwidth memory dies on top of a silicon interposer. 

This allows for the multiples dies to operate as a single chip in one package.

I-Cube 4 was developed in March and the successor to I-Cube2 launched in 2018.

The latest iteration of the packaging technology will allow fast communication and power efficiency between logic and memory chips, Samsung said.