Samsung to apply new image sensor packaging tech to save cost

Samsung is planning to apply a new packaging technology for its image sensors to save cost.

The South Korean tech giant is planning to apply chip scale package (CSP) for low resolution image sensors starting next year, sources told TheElec.

Samsung currently uses chip on board (COB) packaging for its image sensors.

COB places the image sensor on the printed circuit board and connects them through wire bonding. The lens is then attached to it.

The method is the most conventional way to package image sensors. However, the process requires a clean room as the components can be exposed to unwanted materials during the process.

CSP packages the image sensor chip first and connects it with the board without wire bonding. The process is simpler compared to COB and doesn’t require a clean room, which can save cost.

The process is also done at the wafer level, unlike COB that is done at the chip level, which can offer increased productivity.

The downside is CSP can only be done in lower resolution image sensors. Most higher resolution image sensors are done with COB.

However, CSP technology is continuously evolving to support higher resolution and is being used more and more for lower resolution camera modules.

The sources said CSP can support FHD resolution at the current time.

Samsung is applying CSP to save cost. More and more smartphones are supporting multi-camera setups, but the smartphone market is becoming more and more competitive that is forcing manufacturers to lower their prices. The image sensor is also a relatively costly component in smartphones, adding pressure on manufacturers to save costs on them.

Meanwhile, Samsung is also planning to expand dealings with companies that can supply low resolution image sensors, to diversify is suppliers to further lower cost, the sources said.