Hanmi supplies dual-chuck saw for automotive chip package sawing
To global customer
2022-03-17 Jang Keyoung Yoon
Hanmi Semiconductor said on Thursday that it has supplied its Micro SAW T2101 dual-chuck saw to a global automotive semiconductor company.
The company said the saw can cut conventional packages as well as those that are thick or need water-proofing.
Hanmi Semiconductor said it expected to ship more saws due to the global chip shortage.
The company claimed its dual-chuck saw had 40% higher productivity compared to its competitor’s, while it was also fully automatic.
Hanmi Semiconductor launched its first dual-chuck saw in June last year.