Auros Technology supplies chip TSV overlay equipment

Auros Technology, a subsidiary of semiconductor production equipment and component maker FST, is supplying overlay equipment for TSV(Through Silicon Via) procedures to South Korea’s largest semiconductor producer, industry sources said on July 10.

Auros Technology -- currently preparing to get listed on the Kosdaq market -- confirmed the reports. "We've successfully supplied to a prominent global company,” an Auros Technology official told The Elec. “With this deal, we hope to further contribute to system semiconductor chip solutions for next generation technologies such as AI, autonomous cars and 5G."

The official added that this marks the first time for such equipment to be used for TSV.

The equipment supplied by Auros Technology goes by the model number 300nw. They were installed in the semiconductor company’s production facilities in Chungcheong Province.

Overlay equipment is used to verify pattern-to-pattern alignment when manufacturing wafers. It's used primarily for photolithography, but the application scope has recently been expanded to include post-procedures such as TSV and micro bump.

TSVs are high performance interconnect techniques used as an alternative to wire-bond and flip chips to create 3D packages and 3D integrated circuitsIt’s an improvement in terms of efficiency and speed because it doesn’t require additional space to stack the chips

Globally renowned semiconductors have already started to apply TSV to 3-layer stacked image sensors incorporating DRAM and Logic, along with HBM where DRAM chips are stacked and connected with TSV.

Auros Technology said that the firm is now developing next generation overlay equipment, which is to be launched in the latter half of this year.

The Elec is South Korea’s No.1 tech news platform.