SK Hynix has placed a large order to procure thermal compression (TC) bonders to Hong Kong-based ASMPT, TheElec has learned.The South Korean memory maker has ordered over 30 units for the equipment that will be used in the production of HBM3E 12H, its latest iteration of high-bandwidth memory, sourc

DB Hitek is close to clinching a ten-year contract to manufacture power management ICs that will go into Tesla vehicles, TheElec has learned.Staff overseeing quality control for chips for the US carmaker had visited DB Hitek’s facility at Bucheon, South Korea back in June for an inspection.Following

Samsung SDI said on Tuesday that it plans to sell its polarizing film business to Wuxi Hengxin Optoelectronic Materials for 1.12 trillion won.The deal includes all of the South Korean battery maker’s shares in its subsidiary in Wuxi, China as well as its domestic units related to polarizing film in

The memory bosses of Samsung and SK Hynix shared their respective company’s different strategies concerning high-bandwidth memory (HBM) at an industry show in Taiwan on Wednesday.Samsung Memory Business President Lee Jung-Bae and SK Hynix President Juseon Kim made keynote addresses on Wednesday, sha

Sapien Semiconductors said on Monday it has signed a deal with a Silicon Valley-based tech giant to develop LED on silicon (LEDoS) chip for application in augmented reality (AR) glass.The deal is worth 4.8 billion won and the contract expires in October next year, the company said.The chip will come

DB Hitek is planning to contract produce silicon capacitors for a customer starting late in the year, TheElec has learned.Silicon capacitors are made using semiconductor processes unlike multi-layer chip capacitors.They can maintain a stable voltage and have an advantage in removing high frequency n

Sapien Semiconductors CEO Myunghee Lee said on Wednesday that the company aims to turn a profit next year while reaching an annual revenue of 10 billion won this year.Lee noted that the company is expected to announce three more orders it received in the second half of the year, the CEO said in an i

Revenue from semiconductors worldwide grew 18.3% in the second quarter from the same period a year ago, according to the Semiconductor Industry Association.The revenue figures stood at US$149.9 billion, an increase of 6.5% from the previous quarter.Revenue in June was especially strong __ in North A

Sapeon was collaborating with outsourced semiconductor assembly and test (OSAT) companies Amkor Technology and ITEK for the production of its X330 AI chip, TheElec has learned.Amkor will handle the packaging of X330 and ITEK the product test, sources said.Sapeon announced the chip last year and is p

SK Hynix is planning to spend 9.4 trillion won to build a new fab to respond to the high demand for memory chips caused by the AI boom.The new fab will be built at Yongin Semiconductor Cluster, a new semiconductor industrial zone being pushed by the South Korean government.The fab will start constru

Semiconductor packaging firm Genesem has supplied its next-generation hybrid bonding equipment to chipmaker SK Hynix for use in the production of high-bandwidth memory (HBM), TheElec has learned.Genesem has supplied two units of the equipment which were installed at SK Hynix’s pilot fab to test hybr

Doosan Tesna will secure chip packaging capability for synergy with its existing chip testing business, Doosan Group said.The goal is to foster the company into am integrated outsourced semiconductor assembly and test company, the group said.This likely means its wants to offer wafer test, packaging

Semiconductors going forward will stack transistors on top of each other, Jusung Engineering chairman Chul Joo Hwang said.This is because scaling DRAM and logic chips are reaching their limits so DRAM and logic chips will, like NAND, stack transistors on top of each other to overcome this, the chair

Samsung is applying molybdenum in the metalization process of its Gen 9 V-NAND, TheElec has learned.The company has brought in five units of Mo deposition machines from Lam Research for the process, sources said.The South Korean tech giant is planning to bring in twenty additional units next year, t

Hanmi Semiconductor has effectively lost in a patent lawsuit it filed against rival Genesem over patents related to packaging equipment.In fact, it lost more than it bargained for as the court nullified its patents.Hanmi Semiconductor filed the suit against Genesem to the Seoul Central District Cour

Back-end equipment maker ASMPT has supplied a demo thermal compression (TC) bonder for high-bandwidth memory (HBM) production to Micron, TheElec has learned.The equipment maker is collaborating with the US memory giant in co-developing a TC bonder for use in HBM4 production.ASMPT has also supplied T

This week, multiple acquaintances messaged me to ask whether a certain report was true.The report, made in South Korean media, claimed that Nvidia asked Samsung to change the design of their high-bandwidth memory (HBM) and that this would cause further delays in supply. Coincidentally, Samsung’s sha

DB Hitek is expected to manufacture a chip that will go into Tesla cars, TheElec has learned.The automotive chip is being designed by a US fabless chip company, which will conduct audits of DB Hitek in June and October.The June audit will be conducted by the fabless alone, while in October Tesla wil

AI neural processing unit (NPU) firm Aim Future will open its Series B funding round in the second half of the year, Aim Future CEO Changsoo Kim told TheElec.The startup will open the round sometime between October and November and aim to close sometime in the first half of 2025 with the aim to secu

The commercialization of glass substrates will threaten the dominance of advanced packaging technology currently in use such as chip-on-wafer-on-substrate (CoWoS) of TSMC, according a university professor.Glass substrates’ target market was clear and they will be used in AI and server semiconductors