Jusung Engineering was on the cusp of wrapping up the development of new equipment that uses its atomic layer deposition (ALD) technology, CEO Hwang Chul-joo said on Thursday.Some of the kits are a transistor deposition machine, an inorganic emission display deposition machine and manufacturing equi

Samsung is planning to adopt a new board that will allow for narrower circuit width to apply its new fan-out packaging technology for semiconductor boards.The company can use the semi-additive process to reach a circuit width of 2/2 micrometers, Samsung manager Lee Choong-sun said at the 2023 Advanc

Chip probe card maker Micro2Nano is aiming to launch new probe cards for DRAM and NAND for its future growth, the company CEO said on Monday.Micro2Nano CEO Hwang Kyu-ho told a press conference in Seoul its aim was to reduce its reliance on probe cards for NAND for revenue.The electrical die sort (ED

Fab equipment maker Wonik wants to acquire display driver IC company TLI, TheElec has learned.Wonik, which also makes display equipment and chips, has expressed its interest in acquiring the fabless chip company since last year, sources said. The pair have recently met to discuss the issue, they add

Telecommunication chip company RFHIC was testing a microwave generator with a global fab equipment maker as well as a local South Korean fab equipment maker, TheElec has learned.The generator generates high-spectrum, short-distance microwaves __ widely used in the common microwave.The device is also

Extreme ultraviolet (EUV) process adoption by chipmakers in their advanced chip-making is expanding rapidly in recent years.In response to this increasing demand, many companies are developing pellicles for use in the EUV process. South Korean companies S&S Tech and FST have developed those with ove

Nepes Laweh saw its order for fan-out panel level packaging (FO-PLP) work for certain chips by Qualcomm canceled recently, TheElec has learned.The cancellation comes from continued defects and low yield, the sources said.However, Nepes Laweh has retained orders for some of the packaging work low-end

Samsung was developing a new low temperature solder to use in advanced chip packaging.Samsung Advanced Institute of Technology (SAIT) researcher Joo Guen-mo, in a local media conference, said the company expects to apply the technology in commercial production in 2025.Solders are materials used to c

Probe card maker Micro2Nano is expecting its latest electrical die sort (EDS) probe card for DRAM to get approval from key customer SK Hynix within the year.Micro2Nano CEO Hwang Kyu-ho told TheElec on Wednesday that the company will be sending the chipmaker its evaluation sample in May.The card will

Earnings of Semes, the fab equipment-making subsidiary of Samsung, show that the South Korean tech giant is drastically reducing its spending in China.The development is likely due to restrictions being imposed on China by the US.Semes recorded 2.88 trillion won in revenue and 219.3 billion won in o

South Korean analog chipmaker RFsemi has been sold to Chinese electronics maker Jinping Electronics.RFsemi said on Monday that its largest shareholder will be changed from ex-CEO Lee Jin-hyo to Jinping Electronics.The Chinese company will acquire 20 billion won worth of new shares to be issued on Ma

Apple had halted production of its M2 Series SoCs used in MacBooks from January to February, TheElec has learned.While production of the chips resumed in March after the full halt, production volume has dropped by half compared to a year ago, sources said.This is the first time that the iPhone maker

Famed activist fund KCGI said on Thursday that it has acquired a 7.05% stake in chip foundry DB Hitek.The purchase makes KCGI, which stands for Korea Corporate Governance Improvement, the second largest shareholder of the chip company after DB Inc, which controls 12.42%.KCGI said that it was acquiri

Samsung has already spent around 200 billion won in preparation to start manufacturing silicon carbide (SiC) and gallium nitride (GaN) semiconductors.Sources said the spending amount shows that the tech giant can already manufacture prototypes of certain chips.SiC and GaN are being used in the lates

South Korean chip foundry DB Hitek on Wednesday confirmed that it was planning to expand into 12-inch wafer foundry service.DB Hitek CEO Choi Chang-shik confirmed as such during the company’s annual shareholders meeting.Choi said the company is aiming to expand its foundry business’ valuation to 4 t

US memory chip giant Micron on Tuesday announced further reduction in its memory chip production output.The memory chipmaker in its earnings report shared with investors for the second quarter of its 2023 fiscal year (December to February) said expect “meaningfully negative for DRAM” in bit supply g

Siemens expects the global chip market to recover on the back of mega trends such as autonomous driving and AI.The chip industry was going through a fourth downturn and in the past the market has always grown substantially after such a downturn, Joseph Sawicki is Executive Vice President, Integrated

SK Hynix has divided its procurement team for the first time, a move meant to strengthen the purchasing of components and equipment used in the back end of chip production.The procurement team is now divided to a front end team and another back end team, SK Hynix had said its filings to local regula

Chipmaker SK Hynix has moved its global sales and marketing team, known as GSM within the company, from its headquarters at Icheon, south of Seoul, to a separate building at the capital.Some 300 employees of the team will work from Mirae Asset CENTER1 building in downtown Seoul, the chipmaker said.G

Fab equipment maker TES has developed a new plasma cleaner that is going through a quality test by a potential customer, TheElec has learned.South Korean chipmakers have relied on foreign fab equipment makers for the cleaners so TES’ move is meaningful, though commercialization is likely some time a