기사 (723건) 리스트형 웹진형 타일형 Samsung developing next-gen bonding wire tech for automotive chips Samsung developing next-gen bonding wire tech for automotive chips Samsung chip boss boosting trust with partners Samsung chip boss boosting trust with partners JI Tech going public to secure UTC Investment big payday JI Tech going public to secure UTC Investment big payday Samsung names Jay Y. Lee as chairman Samsung names Jay Y. Lee as chairman Samsung’s earnings slump in third quarter from downturn in memory market Samsung’s earnings slump in third quarter from downturn in memory market Nuvoton aiming to expand presence in South Korea Nuvoton aiming to expand presence in South Korea SK Hynix’s operating income drops by staggering 60% SK Hynix’s operating income drops by staggering 60% SK Hynix provides samples of its 6400Mbps DDR5 SK Hynix provides samples of its 6400Mbps DDR5 BC&C is developing ceramic test sockets BC&C is developing ceramic test sockets Samsung adds Coasia Optics as supplier for UDC camera on Fold 4 Samsung adds Coasia Optics as supplier for UDC camera on Fold 4 Pixelplus to show engineering sample of automotive CIS next year Pixelplus to show engineering sample of automotive CIS next year Sapeon to use TSMC 7nm to produce new AI chips Sapeon to use TSMC 7nm to produce new AI chips 처음처음이전이전이전11121314151617181920다음다음다음끝끝