Competition in the advanced die bonder market is intensifying. Besi, ASMPT, and Hanmi Semiconductor have all announced expansion plans in the thermal compression (TC) bonder sector.TC bonders are used to bond individual chips on processed wafers. They started to become in high demand with the launch

Chip design house ASICLAND was developing a new packaging technology to improve the cost of customer TSMC’s chip-on-wafer-on-substrate (CoWoS).CoWoS has room for improvement in performance and power consumption compared to integrated fan-out and organic substrate package, ASICLAND manager Kang Sung-

LB Semicon has acquired battery recycling company GSM.The chip back-end company said it acquired all the company shares for 20 billion won.LB Semicon acquired a 60% stake for 12 billion won and LB a 40% stake for 8 billion won.The new subsidiary will collect scraps and used batteries made during bat

Samsung Display is expected to see its supply of OLED panels for iPhones grow again this year.The South Korean display panel maker received Apple’s approval for all models of OLED panels it will supply to the four models on the iPhone 15 Series and has begun delivery, TheElec has learned.In contrast

WCP said on Monday that it will be supplying lithium-ion battery separators to Samsung SDI.Its Japan-based parent company W-Scope will supply 4 billion meter-square of the separators __ enough to be used in batteries for 5.3 million units of electric vehicles __ for five years up to 2027.The separat

Samsung Display was planning to apply low refraction capping layer (CPL) on its smartphone OLED and was expected to apply them commercially in 2025 at the earliest, TheElec has learned.CPL is formed on top of the cathode and helps the light emitted from the emission layer towards the face of the dis

Samsung’s chip division recorded a steep operating loss of 4.36 trillion won in the second quarter due to the global economic downturn that is causing weak demand for IT products.However, inventory of chips peaked in May and is declining, the South Korean tech giant said, a sign that demand for chip

3D SoC with hybrid bonding applied was the way to overcome the current limitations of microfabrication the chip industry is facing, according to Inha University Professor Rino Choi.And for application of hybrid bonding, back side power delivery network, and other advanced technologies, there need to

Even in high bandwidth memory (HBM) hybrid bonding may be needed to pack in more layers within the confines of the package.This is according to SK Hynix Wafer Bonding Head Kang Ji-ho, who said during a local chip conference hosted by TheElec that HBM with 12-layer or higher can face problems in heig

SK Hynix said on Wednesday that it has recorded 2.9 trillion won in operating loss in the second quarter this year.This means that the South Korean chip giant recorded 6.3 trillion won in operating loss in total for the first half of the year, as the down cycle of the global chip market continues.Ho

Apple has asked its display panel suppliers Samsung Display and LG Display to develop zero-bezel OLED panels, TheElec has learned.While most premium smartphones in the market right now offer screens with very thin bezels, completely removing them is no easy task.The bezel area of the screen houses c

Fab equipment maker Wonik IPS was using multiple securities firms to purchase the shares of competitor APTC, TheElec has learned.Wonik IPS started buying listed shares of APTC in May and the move is ongoing, sources said.It is unknown how many shares Wonik IPS purchased in total for the past two mon

PI Advanced Materials said on Thursday said it has started production of polyimide (PI) powders.Powders made from PI have excellent heat, electricity, and abrasion resistances, the company said.The material is in high demand from the semiconductor, display, aerospace, and other advanced industries a

Dongwha Electrolyte is preparing to produce electrolytes used in batteries at its factory in Soskut, Hungary, TheElec has learned.The company was actively hiring local workers in preparation, sources said. Dongwha will hire approximately 40 workers for the factory is aiming to increase its operation

Nvidia was working to diversify its sourcing of HBM3 and 2.5D packages used in AI GPUs for data centers, TheElec has learned.The US chip giant was negotiating deals with potential suppliers, which includes Samsung, sources said.Currently, Nvidia, for its A100, H100, and other AI GPUs, uses TSMC for

Battery recycling startup Green Li-ion said on Friday that it plans to enter the South Korean market.The Singapore-based company was founded in 2020 and has investors such as GS, Envisioning Partners, and TES. It has received US$36 million in funding so far.Most battery recycling companies use their

Samsung has started the development of a new smart device that will come in the form of a ring, TheElec has learned.The so-called Galaxy Ring will use circuit boards made by Japan’s Meiko, sources said.Printed circuit boards are usually developed first for electronic devices, followed by the compone

Samsung Display has started the development of LED on silicon (LEDoS) microdisplay technology for applications in augmented reality (AR) devices.Samsung Display Vice President and Head of Technology Strategy Team Gong Min Kim believed that in the coming future, LEDoS will replace OLED on silicon (OL

South Korean AI startup Rebellions wants to launch alternatives to AI chips offered by market leader Nvidia.Rebellions CEO Park Sunghyun said the startup’s goal is to, within one to two years, find specific applications that it can offer AI chips that be used instead of those by Nvidia.Specifically,

LG Display believes that OLED on silicon (OLEDoS) technology was the most likely to be applied for virtual reality (VR) devices.At the same time, for augmented reality (AR), LED on silicon (LEDoS) was the more likely technology to become mainstream, Lee Jung-il, LG Display team leader of its Best OL