THE ELEC, Korea Electronics Industry Media

기사 (885건)

[Component] LG Innotek may start development of glass substrates for chip packaging

Gijong Lee | 2024-02-22 09:52

[Semiconductor] Openedges sees revenue from TSMC foundry jump

Noh Tae Min 기자 | 2024-02-19 15:15

[Semiconductor] South Korea’s chip export recovers in January

YUN SANG-HO | 2024-02-16 17:05

[Semiconductor] SK Hynix to procure blank masks from own affiliate

Noh Tae Min 기자 | 2024-02-07 17:55

[Semiconductor] TSE develops STO-ML for logic chip probe cards

JY Han | 2024-02-05 12:49

[Semiconductor] SK Chairman taking part in SK Hynix exec meetings

JY Han | 2024-02-02 18:10

[Semiconductor] SK Hynix to use thick KrF for the production of 238-layer NAND

JY Han | 2023-11-20 10:24

[BATTERY] LS Cable & System Asia to procure rare-earth minerals

Gijong Lee | 2023-11-16 15:46

[Semiconductor] Samsung’s chip business testing PGMEA from Chemtronics

JY Han | 2023-11-16 15:46

[Semiconductor] 'Promising' fabless Fadu disappoints with financial results

Noh Tae Min 기자 | 2023-11-10 15:36

[Semiconductor] Baco Solution surprises with own PVD in global market

JY Han | 2023-11-10 15:36

[Semiconductor] Merck appeals in patent suit over Hf precursor against Tri Chemical

JY Han | 2023-11-09 10:33

[Semiconductor] Wonik’s chip scrubber going through Samsung’s quality test

Noh Tae Min 기자 | 2023-11-03 10:58

[Semiconductor] Israel-Hamas war causes fear of possible hydrogen bromide shortage in chip industry

Noh Tae Min 기자 | 2023-10-24 09:21

[Display Panel] Samsung Display eyes OLED production without the use of FMM

Gijong Lee | 2023-10-24 09:20

[Semiconductor] Qualitas Semiconductor begins development of chiplet interconnect interface IPs

Noh Tae Min 기자 | 2023-09-26 20:58

[Semiconductor] CGP Materials to supply key materials to Nissan Chemical

JY Han | 2023-09-21 10:40

[Semiconductor] South Korean semiconductor material firms facing bleak outlook for remainder of year

Noh Tae Min 기자 | 2023-09-12 16:49

[Component] Korea Circuit supplying automotive FC-BGA to STMicroelectronics

Gijong Lee | 2023-09-12 16:49

[Semiconductor] TC bonder in high demand from HBM and 3D packaging

Noh Tae Min 기자 | 2023-09-07 10:07