Semiconductors going forward will stack transistors on top of each other, Jusung Engineering chairman Chul Joo Hwang said.This is because scaling DRAM and logic chips are reaching their limits so DRAM and logic chips will, like NAND, stack transistors on top of each other to overcome this, the chair

KCTech’s supercritical fluid cleaner was being evaluated by SK Hynix for use in its DRAM production line, TheElec has learned.SK Hynix has been procuring this equipment from Tokyo Electron, so if KCTech passes the evaluation it will become a secondary supplier, sources said.KCTech is expected to pas

Nepes has decided to sell its loss-ridden chip package arm. It has notified private equity funds that has provided loans to Nepes Laweh that it plans to restructure and sell the business, sources said.Nepes plans to leave the bare minimum of researchers at Nepes Laweh then sell it, they said. Nepes

Fab equipment maker Neosem has supplied new inspection equipment for use in Compute Express Link (CXL) 2.0 memory production, becoming the first company to do so, TheElec has learned.The customer is Samsung and the equipment is used to determine whether memory modules that support CXL 2.0 are operat

Samsung was developing a new chip package technology to prevent overheating in application processors (AP), TheElce has learned.The package attaches a heat path block, or HPB, on top of the SoC, and is expected to be used on future Exynos chips, sources said.The technology, called by its full name f

Samsung is applying molybdenum in the metalization process of its Gen 9 V-NAND, TheElec has learned.The company has brought in five units of Mo deposition machines from Lam Research for the process, sources said.The South Korean tech giant is planning to bring in twenty additional units next year, t

Fabless chip firm LX Semicon is entering the intelligent power module (IPM) market, TheElec has learned.The company has succeeded in developing a 600volt (V) IPM for use in home appliances such as refrigerators, washing machines, and air conditioners and was in talks with LG Electronics for a supply

Micron said its high-bandwidth memory (HBM) production capacity has been sold out up to 2025.Previously, SK Hynix also said it sold out its HBM production capacity up to next year.Micron said it recorded US$6.811 billion in revenue in its latest fiscal quarter running from March to May, an increase

Hanmi Semiconductor has effectively lost in a patent lawsuit it filed against rival Genesem over patents related to packaging equipment.In fact, it lost more than it bargained for as the court nullified its patents.Hanmi Semiconductor filed the suit against Genesem to the Seoul Central District Cour

Back-end equipment maker ASMPT has supplied a demo thermal compression (TC) bonder for high-bandwidth memory (HBM) production to Micron, TheElec has learned.The equipment maker is collaborating with the US memory giant in co-developing a TC bonder for use in HBM4 production.ASMPT has also supplied T

South Korea’s export of blank masks used in chip production has jumped 46% in May from a year ago, according to government data.Exports hit US$2.56 million in May, with China accounting for US$1.93 million and accounting for 75.3% of the total, according to data from the Korea Trade Statistics Promo

Samsung’s fab equipment-making subsidiary Semes has succeeded in developing an argon fluoride immersion (ArF-i) lithography track equipment.The first unit of the equipment, called Omega Prime, was supplied last year and Semes was making a second unit, the company said on Monday.South Korean chipmake

This week, multiple acquaintances messaged me to ask whether a certain report was true.The report, made in South Korean media, claimed that Nvidia asked Samsung to change the design of their high-bandwidth memory (HBM) and that this would cause further delays in supply. Coincidentally, Samsung’s sha

DB Hitek is expected to manufacture a chip that will go into Tesla cars, TheElec has learned.The automotive chip is being designed by a US fabless chip company, which will conduct audits of DB Hitek in June and October.The June audit will be conducted by the fabless alone, while in October Tesla wil

South Korean memory chipmakers Samsung and SK Hynix are expected to spply hybrid bonding in their upcoming 3D DRAM.SK Hynix said during the International Memory Workshop 2024 conference held in Seoul last week that it will apply wafer bonding in its 3D DRAM production.Wafer bonding is also called hy

Samsung Foundry is expected to launch 1.4-nanometer (nm) process, back side power delivery network (BSPDN), and silicon photonics in 2027.During its Samsung Foundry Forum held in San Jose on Wednesday, the South Korean tech giant’s contract chip production business unit announced its technology road

South Korean AI chip companies Sapeon and Rebellions seeking a merger to become more competitive as competition heats up among AI chip companies amid the boom.The pair said on Wednesday that the merged entity will be inaugurated within the year after they sign the merger deal within the third quarte

AI neural processing unit (NPU) firm Aim Future will open its Series B funding round in the second half of the year, Aim Future CEO Changsoo Kim told TheElec.The startup will open the round sometime between October and November and aim to close sometime in the first half of 2025 with the aim to secu

The commercialization of glass substrates will threaten the dominance of advanced packaging technology currently in use such as chip-on-wafer-on-substrate (CoWoS) of TSMC, according a university professor.Glass substrates’ target market was clear and they will be used in AI and server semiconductors

SK Materials Airplus said on Monday that it will spend 700 billion won to build plants to produce gaseous nitrogen (GN2) and clean dry air (CDA).The two gases are used in chip production. GN2 is used a carrier gas to transport precursors on the wafers during deposition. It is also used to prevent ox