Even in high bandwidth memory (HBM) hybrid bonding may be needed to pack in more layers within the confines of the package.This is according to SK Hynix Wafer Bonding Head Kang Ji-ho, who said during a local chip conference hosted by TheElec that HBM with 12-layer or higher can face problems in heig

SK Hynix said on Wednesday that it has recorded 2.9 trillion won in operating loss in the second quarter this year.This means that the South Korean chip giant recorded 6.3 trillion won in operating loss in total for the first half of the year, as the down cycle of the global chip market continues.Ho

Fab equipment maker Wonik IPS was using multiple securities firms to purchase the shares of competitor APTC, TheElec has learned.Wonik IPS started buying listed shares of APTC in May and the move is ongoing, sources said.It is unknown how many shares Wonik IPS purchased in total for the past two mon

Nvidia was working to diversify its sourcing of HBM3 and 2.5D packages used in AI GPUs for data centers, TheElec has learned.The US chip giant was negotiating deals with potential suppliers, which includes Samsung, sources said.Currently, Nvidia, for its A100, H100, and other AI GPUs, uses TSMC for

Managing the power efficiency of data centers is a large issue in the chip industry as trends such as AI and self-driving cars are causing exponential increases in the amount of data.Because of this, the amount of data formed in the past two years equaled that of around 90% of the data made througho

China’s ChangXin Memory Technologies and other DRAM companies in Greater China are expected to see exponential growth in the coming years despite US sanctions against China, a South Korean professor said.This growth will be substantial enough to threaten the three-way dominance of the DRAM industry

SK Hynix said on Tuesday that it has started verification of its latest Gen 5 (1b) 10-nanometer (nm) server DDR5 DRAM with Intel.Once approved, the new memory chip will be paired with Intel’s Xeon Scalable Platform server processors.SK Hynix said its latest DDR5 DRAM has a speed of 6.4Gbps and claim

Samsung has formed a team to develop a 4F2(feature square) DRAM, TheElec has learned.If the tech giant succeeds, it will be able to reduce the surface of die by 30% compared to 6F2 DRAM, sources said.Memory chipmakers attempted to commercialize 4F2 ten years ago but failed at the time.But now Samsun

Tokyo Electron is expected to install the demo version of its new hybrid oxide etcher at a place designated by Samsung Electronics’ chip research group, Semiconductor Research & Development, TheElec has learned.The fab equipment maker’s new product is called hybrid because it uses the traditional RF

SK Hynix has become the first memory chipmaker to claim that the market has hit bottom during the first quarter.The memory chipmaker on Wednesday reported 3.4 trillion won in operating loss.But the South Korean chipmaker said the company is expecting a rebound after the second quarter.Analysts and s

The chip industry is looking for alternative materials to coolants since major producer 3M’s announcement of halting production.Coolants are used in the etching process in chip production to prevent overheating.Samsung and SK Hynix relied on 3M for the material as it accounted for 90% of the product

The global CMOS image sensor market contracted for the first time in seven years last year due to low demand for electronics and IT devices, according to Japanese analyst firm Techno Systems Research (TSR).Sony, the undisputed leader in the sector, saw its market share increase during this drop whil

Chip probe card maker Micro2Nano is aiming to launch new probe cards for DRAM and NAND for its future growth, the company CEO said on Monday.Micro2Nano CEO Hwang Kyu-ho told a press conference in Seoul its aim was to reduce its reliance on probe cards for NAND for revenue.The electrical die sort (ED

Probe card maker Micro2Nano is expecting its latest electrical die sort (EDS) probe card for DRAM to get approval from key customer SK Hynix within the year.Micro2Nano CEO Hwang Kyu-ho told TheElec on Wednesday that the company will be sending the chipmaker its evaluation sample in May.The card will

US memory chip giant Micron on Tuesday announced further reduction in its memory chip production output.The memory chipmaker in its earnings report shared with investors for the second quarter of its 2023 fiscal year (December to February) said expect “meaningfully negative for DRAM” in bit supply g

SK Hynix has divided its procurement team for the first time, a move meant to strengthen the purchasing of components and equipment used in the back end of chip production.The procurement team is now divided to a front end team and another back end team, SK Hynix had said its filings to local regula

Chipmaker SK Hynix has moved its global sales and marketing team, known as GSM within the company, from its headquarters at Icheon, south of Seoul, to a separate building at the capital.Some 300 employees of the team will work from Mirae Asset CENTER1 building in downtown Seoul, the chipmaker said.G

Magnachip is planning to downsize its workforce by 5% due to last year’s poor earnings and the overall downturn of the global chip market.The chipmaker was offering voluntary retirement to up to 5% of its workforce, sources said, out of its total workforce of 900.This is likely a precursor before a

Yes Power Technix is expected to start operation of its new fab in Busan this month that will manufacture silicon carbide (SiC) power management IC, parent company SK Holdings said on Tuesday.The four-story fab, which went into construction near the end of 2021, will manufacture 150mm SiC power mana

Samsung is expanding the use of automation in its sub-fabs that supply gases and chemicals to fabs, TheElec has learned.The South Korean tech giant is automating the drum logistics systems and installing more automatic clean quick couplers in its sub-fabs, sources said.This was being done to increas