Outsourced semiconductor assembly and test (OSAT) firm LB Semicon is planning to offer fan-out wafer-level package (FOWLP) service next year at the earliest, TheElec has learned.The company completed the development of relevant technologies earlier this year and has been testing them with an analog

Key Foundry said on Thursday that it has launched a new foundry service for power management ICs (PMIC) that doesn’t use an epitaxial layer on the wafer.The company said its new 0.18-micron 30V NON-EPI BCD (bipolar-CMOS-DMOS) process offers the same performance as similar processes that do use epita

Overlay equipment maker Auros Technology was developing a critical dimension (CD) measurement equipment for use in the packaging process during chip production.The equipment, called CD meter, was being tested by backend process companies and is being aimed to be commercialized this year.CD measureme

Secondhand fab equipment seller Surplus Global said on Thursday that it will offer a service for foundry companies to test their new chips.With the service, called R&D Foundry, the company will offer to manufacture 12-inch thin-film test wafers and prototype evaluations for customers.Surplus Global

Fab equipment maker FST had formed a subsidiary in the US in Delaware dedicated to after-sales services, TheElec has learned. The company is also planning to form another at Taylor, Texas in preparation for Samsung’s new fab that will be built in the city.FST specializes in chillers used in wafer fa

Samsung Electronics was repositioning hundreds of employees at Samsung Display to its chip packaging business unit, TheElec has learned.The company is taking applications from employees at its display business unit for the transfer, people with direct knowledge of the matter said.Those 37-years-old

Auros Technology has won orders to supply overlay equipment for 8-inch wafers from multiple South Korean and Japanese chipmakers, TheElec has learned.The company’s 8-inch OL-100n was being evaluated by up to five companies based in the East Asian countries, sources said.The customers were considerin

Semiconductor testing solution firm ISC said on Monday that it has launched a new rubber socket for 3D chip packaging.The socket, called iSC-WiDER, is a successor to its socket aimed at CPU and GPU chips.The latest iteration can also be used to test microcontroller units and for 2.5D and 3D packagin

Nextin CEO said the company was developing a machine to remove static electricity with its recently acquired firm Zisys.Nextin CEO Tae Hoon Park said during an interview with TheElec that this machine will be able to remove static electricity that was irremovable in previous machines during the extr

Neosem was currently developing a direct current (DC) tester to supply to a major chip firm, TheElec has learned.The tester is used to see whether wafers that completed the front-end process have the same electric characteristics as expected. It measures the input and output voltage of each device o

Chip firm Nemesis said on Monday that it plans to commence preclincal trials for the continuous glucose monitoring (CGM) sensor in September.The sensor will use a needle smaller than 10mm to check the glucose level of patients.This differs from conventional blood glucose monitoring sensors that draw

APACT said on Friday that it will acquire ATsemicon’s packaging business unit.The unit does semiconductor packaging and testing and APACT will take over the packaging part.ATsemicon’s customers include SK Hynix and other fabless chip firms.APACT recently built a second factory for packaging and is e

Spending on advanced packaging by chipmakers this year is expected to reach US$15 billion, according to analyst firm Yole Development.Out of that total, Intel will account for 32% with US$4.75 billion, a significant increase from US$3.5 billion last year.TSMC meanwhile will account for 27% with US$4

Schneider Electric unveiled its switchgear that doesn’t use sulfur hexafluoride (SF6) gas.The company unveiled its eco-friendly switchgear lineup AirSet at a press conference in Seoul on Thursday.Fluoride is widely used in the semiconductor sector to insulate heat but is harmful to the environment d

Fab equipment maker SEMCNS is aiming to win approval from Samsung for its ceramic space transformer (STF) used in CMOS image sensor (CIS) probe cards during testing.The company is quality testing the equipment to secure the approval by the first half of the year, sources said.Probe cards are used to

Fab material company Wonik QnC is planning to increase its spending to expand its factory in Taiwan, TheElec has learned. The company initially aimed to spend 17 billion won to expand its factory there during the second quarter, but recently decided to up it 30 billion won, people familiar with the

Chip design house Gaonchips said it plans to focus on developing IPs for automotive and AI chips.Company CEO Jung Kyu-dong said during the company’s press conference ahead of its IPO said demand for design house services from the semiconductor industry was rising as chipmakers are focusing on develo

Samsung has denied market concerns over the future of its memory and foundry chip businesses during the conference call for the first quarter of 2022 on Thursday.The South Korean tech giant was asked by an analyst about rumors that it could skip the development of 1b DRAM and go right to 1c.1b refer

LX Semicon saw its operating profit for the first quarter of 2022 jump thanks to the high demand for display driver IC (DDI).The fabless chip company said on Monday in its preliminary earning guidance that it recorded 585.1 billion won in revenue and 127.9 billion won in operating profit during the

ACM Research was planning to build a fab equipment factory in South Korea, TheElec has learned.The company recently opened a regional subsidiary called Korea ACM, which it wholly owns.ACM Research is a fab equipment maker that was founded in Silicon Valley in 1998 and listed on Nasdaq in 2017.The co