Sound-tracing chip company Exarion said on Thursday that it has signed a multi-project wafer service contract with Asicland, a design house partner of TSMC, for the production of a 12-nanometer (nm) prototype.Exarion’s sound-tracing chip will be made using the Taiwanese chip foundry’s 12nm process a

Dongjin Semichem has begun supplying chemical mechanical polishing (CMP) slurry to SK Hynix for the latter’s high bandwidth memory (HBM) production, TheElec has learned.The deal breaks Soulbrain’s monopoly over the material for use in HBM production in South Korea.HBM production by Samsung and SK Hy

Texas Instruments was converting its gallium nitride (GaN) chip production for 6-inch wafers to 8-inch ones in multiple fabs, a company executive said on Tuesday.The analog chip company was preparing 8-inch fabs at Dallas and Aizu in Japan which will allow it to offer more price-competitive GaN chip

Hanwha Precision Machinery was developing a new thermal atomic layer deposition (ALD) equipment used in wafer fabrication that can deposit molybdenum, TheElec has learned.Molybdenum, compared to tungsten, has a lower resistivity and doesn’t leave fluoride residue after it is deposited.This has made

Samsung on Tuesday unveiled its Gen 5 HBM, HBM3E, which sports 12 stacks of DRAM modules compared to 8 offered by rival Micron's which was announced hours prior and has started mass production.The South Korean tech giant’s announcement indicates that the competition over the dominance of HMB, or hig

Samsung was considering applying molded underfill (MUF) in its next-generation DRAM, TheElec has learned.The tech giant used thermal compression non-conductive film (TC NCF) in its existing registered dual in-line memory module (RDIMM).But Samsung recently tested a mass reflow (MR) MUF process to 3-

YEST said on Monday that it has developed a new technology that can increase the productivity of the annealing process during wafer fabrication.A high-pressure annealing equipment that uses the technology can process 125 wafers at one time, up from 75 of previous equipment.YEST said global chipmaker

Nepes has been steadily selling its shares in one of its key subsidiaries for the past month which critics say is aimed at saving another subsidiary that has accumulated losses over the years.Nepes, from January 15 to February 21, has offloaded approximately 600,000 shares in total, or 4.93% of its

Intel was increasing its sales activity against South Korean fabless chip companies, TheElec has learned.Intel CEO Pat Gelsinger last year met with senior executives of these companies and updated them on its chip foundry plan, sources said.The US chip giant was heavily pitching its 18A process node

Intel said on Wednesday that it has secured US$15 billion worth of chip foundry orders as of the first quarter of this year.The company also announced that it has secured Microsoft as a foundry customer during its first foundry even Intel Foundry Direct Connect at San Jose.The US chip giant previous

Samsung said on Tuesday that it will optimize Arm’s SoC IPs to its gate-all-around (GAA) chip process node.Their collaboration will make the GAA process accessible to fabless customers, saving them time and money, the South Korean tech giant said.Optimization of Cortex-X, Arm’s high-end chip archite

Chip giant TSMC on Monday unveiled a new packaging platform for high-performance computing and AI chips that uses silicon photonics to improve the interconnect.Kevin Zhang, vice president of business development at TSMC, said during ISSCC 2024 __ IEEE International Solid-State Circuits Conference __

Intel said on Monday that it aims to ship over 100 million units of AI PC processors by next year.Intel Korea vice president Choi Won-hyuk said during a press conference in Seoul that the company aims to manufacture and supply chips for “AI” PCs of 40 million units this year and 60 million units in

South Korean chip IP firm Openedges said on Monday that it saw around a third of its revenue last year from Taiwanese chip giant TSMC’s value chain.The company, a Samsung IP partner, said it recorded 6.3 billion won in revenue from its dealings with the Taiwanese foundry __ an increase of 82.5% from

South Korea’s semiconductor exports in January increased substantially, showing the global chip market is on track to rebound.The Ministry of Science and ICT said on Friday that the country recorded US$16.35 billion in exports and US$11.85 billion in imports for tech-related products, resulting in a

LSE was in the middle of installing scrubbers for through silicon via (TSV) for high bandwidth memory for SK Hynix, TheElec has learned.The fab equipment maker has provided two units to the chipmaker’s fab at Cheongju, called Cheongju Campus.Electronics parts maker LTC acquired Mujin Electronics’s f

Lam Research has changed the president of its South Korean operation amid stiff challenges ahead __ from rival Tokyo Electron’s aggressive push to its ongoing patent lawsuits with PSK.The fab equipment maker named Park Joon-hong as the new president of Lam Research Korea on January 30. The new presi

Fab equipment maker Tokyo Electron said it will begin shipping its new etching equipment under development next year.The new etcher is being developed to etch the channel holes on NAND chips with over 400 layers.It is a big move by Tokyo Electron as NAND channel hole etchers are currently only being

Samsung and SK Hynix are expanding their use of extreme ultraviolet (EUV) lithography as they transition to the production of more and more advanced DRAM.This means demand for high-purity carbon dioxide (CO2) gases is also expected to increase. These gases are used to make the light source used in E

SK Hynix has been procuring blank masks from its own affiliate SK Enpulse since last year, TheElec has learned.This is an important milestone for SK Hynix as it has mostly procured its blank masks from foreign companies.SK Enpulse is the second company in South Korea to be supplying blank masks to c