THE ELEC, Korea Electronics Industry Media

기사 (547건)

[Semiconductor] SK Hynix could increase DRAM production in first quarter, CEO says

YUN SANG-HO | 2024-01-11 13:37

[Semiconductor] Samsung orders dozens of TC bonders from Semes

Noh Tae Min 기자 | 2024-01-08 11:30

[Semiconductor] Samsung orders 'significant' number of 2.5D bonding equipment from Japan

JY Han | 2023-12-04 09:54

[Semiconductor] Photomask in shortage from China and AI chip development

Noh Tae Min 기자 | 2023-11-24 13:57

[Semiconductor] Nextin supplies Gen 3 wafer inspection equipment to Chinese customer

Noh Tae Min 기자 | 2023-11-24 13:57

[Semiconductor] SK Hynix to use thick KrF for the production of 238-layer NAND

JY Han | 2023-11-20 10:24

[Semiconductor] Samsung’s chip business testing PGMEA from Chemtronics

JY Han | 2023-11-16 15:46

[Semiconductor] Onsemi’s fab in South Korea suffers power outage

Noh Tae Min 기자 | 2023-11-10 15:36

[Semiconductor] 'Promising' fabless Fadu disappoints with financial results

Noh Tae Min 기자 | 2023-11-10 15:36

[Semiconductor] Baco Solution surprises with own PVD in global market

JY Han | 2023-11-10 15:36

[Semiconductor] Merck appeals in patent suit over Hf precursor against Tri Chemical

JY Han | 2023-11-09 10:33

[Semiconductor] DRAM price increases for the first time in over 2 years

YUN SANG-HO | 2023-11-03 10:58

[Semiconductor] Wonik’s chip scrubber going through Samsung’s quality test

Noh Tae Min 기자 | 2023-11-03 10:58

[Semiconductor] SemiFive aiming to win 100 billion won worth of orders this year

Noh Tae Min 기자 | 2023-10-31 17:56

[Semiconductor] Israel-Hamas war causes fear of possible hydrogen bromide shortage in chip industry

Noh Tae Min 기자 | 2023-10-24 09:21

[Semiconductor] Hybrid bonding could be applied to DRAM, analyst say

Roh Tae Min | 2023-10-16 10:30

[Semiconductor] Samsung to use Exynos again for Galaxy S24 Series

Yoon Sang-ho | 2023-10-10 10:08

[Semiconductor] Intel to begin production of 1.8nm chips in 2025

Noh Tae Min 기자 | 2023-09-26 20:59

[Semiconductor] Qualitas Semiconductor begins development of chiplet interconnect interface IPs

Noh Tae Min 기자 | 2023-09-26 20:58

[Semiconductor] CGP Materials to supply key materials to Nissan Chemical

JY Han | 2023-09-21 10:40