Econy will handle all the back-end processing orders for the ultra-thin glass (UTG) that Samsung will use for its Galaxy Z Flip 6 smartphone, TheElec has learned.For the UTG of Galaxy Z Fold 6, Samsung will continue to use Dowoo Insys as its back-end processing contractor, sources said.Back-end proc

3M is aiming to quadruple its revenue from chemical mechanical polishing (CMP) pads by 300% in three years.Yang Yong-suk, technical supervisor of electronic material at 3M Korea, said during a local event hosted by the company said transistors in advanced nodes were going to nano-scale but results w

Samsung manufactured more smartphones and tablets than it aimed to during the first quarter this year, TheElec has learned.The tech giant manufactured 64.5 million units of smartphones and tablets during the quarter, 22% higher than it initially targeted at the year’s start, sources said.Samsung had

South Korea’s export of semiconductors climbed for the fifth consecutive month as of March.Total semiconductor exports hit US$11.69 billion in March, an increase of 33.9% from a year earlier, according to the Ministry of Science and ICT.Memory chips accounted for US$7.45 billion, with system chips a

Universal Display Corporation’s (UDC) plan to commercially launch a phosphorescent blue emitter material for OLED panels by the end of this year seems up in the air.Sources based in South Korea told TheElec that the emitter’s performance is still unstable and when and on what display panel they will

“That promise has been kept,” Li Mei, the chairperson of Taiwan’s Fair Trade Commission, told the parliament in December of last year.They were responding to a question on whether US chip giant Qualcomm kept its promise to invest $700 million in the country.The company, known for its Snapdragon proc

Fab equipment maker Tokyo Electron’s cryo etching equipment is using hydrogen fluoride (HF).Etching is done to NAND to form the channel holes previously used carbon fluoride (CF).But with ultra-low temperature etching required for advanced NANDs (Gen 10 and up), the use of CF is expected to dramatic

LG Electronics has sold 48 patents to Chinese smartphone maker Oppo.According to the United States Patent and Trademark Office, the South Korean electronics maker sold the standard essential patents to Oppo in November.The SEPs are related to codec, the technology needed to compress digital video an

Samsung has won Nvidia as a customer for 2.5D packaging, TheElec has learned.The company’s Advanced Package (AVP) team will be providing the interpose and I-Cube, its 2.5D package to the GPU maker, sources said.The high bandwidth memory (HBM) and the GPU wafer production will be handled by other com

LG Display has diversified its supply line for display driver ICs (DDI) it uses in OLED panels for customer Apple.Taiwan’s Novatek will supply the chips for the first time this year along with existing supplier LX Semicon, for OLED panels to go on iPhone 16.LG Display’s move is likely aimed at contr

LG Energy Solution said on Thursday that it has started construction of its new battery factory in the state of Arizona, which it will spend 7.2 trillion won.It is the second factory it is building on its own in North America. The plant will manufacture cylindrical batteries aimed at electric vehicl

SK Hynix said on Thursday that it will spend US$3.87 billion to build a chip packaging plant in Indiana state in the US.The plant will provide packaging services for memory chips aimed at AI applications.It will start shipping next-generation high bandwidth memory (HBM) in 2028.

AI chip firm Sapeon will collaborate with design house Alphawave Semi to develop its Gen 3 AI chip, X430, TheElec has learned.Sapeon signed a 59.6 billion won deal with the design house in February for the design service.X430, which will launch in 2026, will be made with TSMC’s 5-nanometer (nm) node

Display wet equipment maker FNS Tech is aiming to supply etching equipment for glass substrates aimed at chip packages, TheElec has learned.It is hoping to supply the kits to SKC Absolics, which is developing glass chip packages and building a dedicated factory in the state of Georgia in the US.FNS

Samsung said on Wednesday that it has manufactured a sample of a 16-stack high bandwidth memory (HBM).During a local conference hosted by The Korean Microelectronics and Packaging Society, Samsung vice president Kim Dae-woo said the tech giant manufactured the chip with hybrid bonding around a week

Display component maker Anapass will be supplying display driver ICs that will be used in OLED panels for Samsung Galaxy S24 Fan Edition (FE), TheElec has learned.The company, which specializes in time controllers, or T-cons, has begun manufacturing the ICs, which are called TCON embedded driver ICs

Samsung is forming a team of around 400 employees to work on high bandwidth memory (HBM) alone, TheElec has learned.Last month, TheElec reported that the South Korean company planning to convert its task force for HBM into a permanent office.The new HBM development team will be under the direct supe

South Korean battery maker SK On will go public no later than 2028, an up to a two-year delay from the initial date that was proposed.Kim Jun, the vice chairman of SK On’s parent company SK Innovation, said on Thursday during SK Innovation's annual shareholders' meeting that the possible adjustment

Chip fabless firm Fadu made repeated apologies during its annual shareholder’s meeting amid lackluster earnings and the drop in share prices.The company’s share prices opened at 31,000 won per share when it went public last year but as of Thursday, its shares were trading at 16,280 won per share, a

LG Electronics CEO William Cho said on Tuesday that the company was open to equity investment and joint ventures with over-the-top content companies.In the TV market today, FAST, or free ad-supported streaming TV, platforms were gaining attention, the CEO stressed during the electronics maker’s annu