Demand for advanced semiconductor package was on the rise concurrently with the demand rise for networks due to increased remote work in light of the COVID-19 pandemic, an executive at Amkor Korea said on Wednesday.
Speaking at KPCAshow2020, South Korea’s largest printed circuit board tradeshow, SungSoon Park, senior director at Amkor Korea, said the pandemic has not caused a negative impact on the semiconductor industry.
While many industries contracted from the pandemic, semiconductor benefited from the demand rise for networks. The outlook for the package market remained optimistic, Park said.
Demand for reliability has also increased however, and the package market will grow in the direction that secures performance, size and reliability, he added.
Advanced package technology is used to make semiconductors slimmer while maintaining their high performances. In semiconductors, system-in-package module board are used while for networks there is flip chip ball grid array (FC-BGA).
Network semiconductors are highly priced and are focused on performance. For package, FC-BGA are usually used.
In contrast, smartphone packages is moving towards miniaturization. The aim is to pack more chips into a smaller package as demand for 5G and various features grow.
