Hanmi Semiconductor on Tuesday said it has launched its latest version of its flagship semiconductor production equipment Vision Placement 8.0.
The new kit can be used for semiconductor cutting, cleaning, inspection and sorting.
Vision Placement 8.0 was developed to meet demand for cutting of ultra-fine printed circuit board panels, which is used for wafer level package and panel level package for smartphones.
Hanmi also put in an over head transport on the kit to help customers in their factory automation efforts.
Hanmi said it expected chip demand from artificial intelligence, smart cars, data centers and 5G to increase going forward, and its equipment sales will increase with this.