ACM Research has launched alloy anneal capabilities for its Ultra Fn Furnace tool to extend its furnace product line to power device manufacturers.
The new feature was added in to meet requirements from insulated gate bipolar transistor (IGBT) devices as transistors get thinner, smaller and faster.
The Ultra Fn Furnace tool with alloy anneal capabilities is customized to perform anneal processes under protective inert gas, reductive gas conditions or high vacuum conditions down to the micro-Torr level, ACM Research said.
With the special design in the wafer handling system, process tube and boat, it also can be applied for thin wafers or taiko wafers, the company said.
The system is intended for batch processing of up to 100 12-inch (300mm) wafers.
The applications of the Ultra Fn system also can be extended into the low pressure chemical vapor deposition (LPCVD) process for SIN, HTO, un-doped poly and doped poly deposition, gate oxide deposition process, ultra-high temperature processes up to 1200 Celcius, and atomic layer deposition (ALD).
IGBT activates/modifies electrical energy in several modern appliances, such as cookers, microwaves, electric cars, trains, variable-frequency drives (VFDs)
