Semiconductor package and test company Winpac begin uMCP packaging for SK Hynix, TheElec has said on Tuesday.
uMCP combines mobile DRAM (LPDDR) and NAND Flash (in this case Universal Flash Storage) into one product.
It has faster than eMCP and consumes less power. The chip is used in smart devices such as smartphones and tablets.
Winpac is expecting sales of 16.5 billion won through its uMCP packaging for SK Hynix.
The global smartphone market is expected to rebound this year and sales from uMCP is expected to increase along with it.
Winpac will combine LPDDR5 mobile DRAM and UFS with over 256GB storage for SK Hynix.
The company bought new equipment for uMCP packaging last year, a Winpac spokesperson said. Full year sales in 2021 is expected to increase 15% to 20% thanks to new orders for uMCP, they said.
Flip chip and new uMCP packaging will lead sales this year, they added.
Last year, Winpac is expected to have posted sales of 110 billion won. New uMCP order is expected to add between 16.5 billion won to 22 billion won to this this year.
Winpac’s sales has been increasing for the past three years. In 2018, the company posted sales of 67.5 billion won, a rise of 43% from the previous year. In 2019, the firm posted 97.9 billion won, a rise of 45% from 2018. In the 2020, as of the third quarter, the company posted in total 83.5 billion won in sales, a rise of 30% from the same time period a year ago.
In the third quarter of 2020, SK Hynix accounted for 77% of Winpac’s sales. The company’s other customers include parent company TLI as well as JSC, Essencore and Fidelix. Winpac’s recent sales increase is tied to SK Hynix’ increased shipment and demand for high performance memory products.
Flip chip and package-on-package led the sales of Winpac’s packaging business. Winpac spend 4.9 billion won in expanding production facilities in 2019, which helped it execute orders. Accumulated sales up to the third quarter of 2020 was 48 billion won, a rise of 25% from the same time period a year ago.
Memory companies are expected to supply uMCP for the smartphone market in full scale this year. Samsung Electronics showed off uMCP that combines 10nm 12GB LPDDR5 and 256GB UFS3.1 at CES 2021. Micron, in March last year, showed off uMCP that combines 10nm LPDDR5 and 256GB UFS.