UPDATED. 2024-03-28 05:14 (목)
Chips&Media signs video IP contract with US mobile chip firm
Chips&Media signs video IP contract with US mobile chip firm
  • Nari Lee
  • 승인 2021.08.18 17:32
  • 댓글 0
이 기사를 공유합니다

Image: Chips&Media
Image: Chips&Media

Semiconductor IP firm Chips&Media said on Wednesday that it has signed an IP contract with a US-based mobile semiconductor company.

In 2019, the firm had signed a similar contract with one of the so-called FAANG companies __ Facebook, Amazon, Apple, Netflix and Google.

Chips&Media said it is expecting royalty payment from the firm going forward, which will be reflected on its earnings within the year.

The company’s mobile IP business is expected to account for around 10% of its sales this year, it also said. The business previously only pitched in around 1% of its sales.
 


댓글삭제
삭제한 댓글은 다시 복구할 수 없습니다.
그래도 삭제하시겠습니까?
댓글 0
댓글쓰기
계정을 선택하시면 로그인·계정인증을 통해
댓글을 남기실 수 있습니다.

  • 515, Nonhyeon-ro, Gangnam-gu, Seoul, Republic of Korea 4F, Ahsung Bldg.
  • 대표전화 : 82-2-2658-4707
  • 팩스 : 82-2-2659-4707
  • 청소년보호책임자 : Stan LEE
  • 법인명 : The Elec Inc.
  • 제호 : THE ELEC, Korea Electronics Industry Media
  • 등록번호 : 서울, 아05435
  • 등록일 : 2018-10-15
  • 발행일 : 2018-10-15
  • 발행인 : JY HAN
  • 편집인 : JY HAN
  • THE ELEC, Korea Electronics Industry Media Prohibiting unauthorized duplication,publishing,modification and distribution the material on this Site for any purpose.
  • Copyright © 2024 THE ELEC, Korea Electronics Industry Media. All rights reserved. mail to powerusr@thelec.kr
ND소프트