Samsung said on Thursday that it has developed a new chip packaging technology.
Called H-Cube and developed together with Amkor Technology and Samsung Electro-Mechanics, the 2.5 dimension packaging technology can house logic chips and high bandwidth memories (HBM) on a silicon interposer, the tech giant said.
2.5D packaging connects chips vertically and the silicon interposer increases data transfer speed.
It can house over six HBMs and is aimed at high-performance computing and data center applications, Samsung said.
Samsung said it narrowed the solder ball width by 35% to minimize the size of the package.
The company launched its first 2.5D packaging solution in 2018.
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