Hana Micron has been developing flexible packaging technologies aimed at the use of wearable devices and medical devices.
The project started last year and is being conducted as a five-year plan, a company spokesperson said.
The first result of the project is an ECG sensor module developed late last year aimed at medical patches.
The module allows the sensor to be under 1mA in power and under 5ms in latency, Hana Micron said.
The company applied its existing 3D flexible semiconductor packaging technology on the module for flexibility and reliability of the patches.
The packaging technology allows for semiconductor devices stacked in multiple layers to be bent or flexible.
This makes it optimal for wearable and medical devices that are usually also not rigid.
Hana Micro’s current mainstay is packaging for memory products such as eMMC, eMCP and LPDDR.
It is aiming to expand into packaging for logic chips.
