Overlay equipment maker Auros Technology was developing a critical dimension (CD) measurement equipment for use in the packaging process during chip production.
The equipment, called CD meter, was being tested by backend process companies and is being aimed to be commercialized this year.
CD measurement equipment is used to horizontally measure how uniform the width of patterns on the wafer. Overlay measurement measures vertically.
The measurement all offers noise reduction through various image filters and an algorithm to maximize the measurement signal.
This allows it to react to various packaging processes from wafer level package to fan out-panel level package, the company said.
The CD meter also comes with an algorithm to detect the pattern edges and offer repeated re-measurements for increased reliability, Auros Technology said.
Its range is 5 micrometers to 300 micrometers and can react to 8-inch and 12-inch wafers.
Meanwhile, analyst firm Yole Development expects high-end performance packaging market to grow 19% per year on average from 2021 onward to 2027, when the market will be worth US$7.87 billion.