UPDATED. 2024-04-11 10:05 (목)
Samsung developing ‘low temperature’ solder for chip packaging
Samsung developing ‘low temperature’ solder for chip packaging
  • Noh Tae Min 기자
  • 승인 2023.04.06 18:00
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To adopt in 2025
Image: TheElec
Image: TheElec

Samsung was developing a new low temperature solder to use in advanced chip packaging.

Samsung Advanced Institute of Technology (SAIT) researcher Joo Guen-mo, in a local media conference, said the company expects to apply the technology in commercial production in 2025.

Solders are materials used to connect the chip diet to the package board.

In the context of solders, low temperature means 150 Celsius or below. Low temperature is important as it lessens the likelihood of damaging the board during the process.

Lenovo and Intel are leaders in this field and have applied the technology to their products.

Samsung is a latecomer in this sector and is focusing on bismuth (Bi). The tech giant is aiming to use the chemical element to performance level with Sn-Ag-Cu, or SAC.

Joo said that Samsung has developed a solder that uses Bi that performs 92.1% close to SAC.

The company is aiming to develop a solder that matches the performance of SAC.

Using low temperature solder also improves the thermal resistance of the package.

This means more inexpensive materials can be used, which reduces cost.
 


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