South Korean printed circuit board company Korea Circuit was supplying high-end automotive flip chip (FC)-ball grid array (BGA) boards to STMicroelectronics, TheElec has learned.
Korea Circuit first secured Broadcom as a customer when it began manufacturing FC-BGA.
STMicroelectronics was accounting for around 30% of the PCB company’s total revenue, the sources also said.
This is despite the current downturn of the global semiconductor market as demand from the automotive sector is still high.
Back in July 2020, Korea Circuit announced that it signed a 6-year supply contract for FC-BGA worth 72 billion won with an unnamed customer. The customer was largely thought to be Broadcom at the time.
In September of the following year, the PCB company announced another 6-year supply contract worth 90 billion won. Two months later, Korea Circuit announced a spending plan of 200 billion won to build new FC-BGA production facilities.
Despite the deal with STMicroelectronics, Korea Circuit recorded 110.9 billion won in revenue from the sale of chip boards, down 23% year-on-year.
