UPDATED. 2024-06-18 18:50 (화)
SK Hynix to use TSMC's base die for HBM4
SK Hynix to use TSMC's base die for HBM4
  • Noh Tae Min 기자
  • 승인 2024.04.22 18:09
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Image: SK Hynix
Image: SK Hynix

SK Hynix is planning to use TSMC’s base die technology for its next-generation high bandwidth memory (HBM).

The South Korean memory maker used its own process to make the base die for its latest HBM3E.

For the follow-up HBM4, which will start mass production in 2026, SK Hynix will use TSMC’s advanced node, the South Korean company said on Friday.

SK Hynix is expected to use the Taiwanese foundry’s 7-nanometer (nm) process.

HBM has a base die where the DRAM core dies are stacked on top of it using through silicon via (TSV). The base die is connected to the GPU and acts as a controller of the HBM, so its performance is important.

Meanwhile, the pair also plan to work on optimizing the combination of their HBM and chip-on wafer-on-substrate (CoWoS, TSMC’s packaging technology) technologies and respond to customer’s HBM needs, SK Hynix said.


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