UPDATED. 2024-06-14 08:17 (금)
LG Chem testing build-up film with FC-BGA customer
LG Chem testing build-up film with FC-BGA customer
  • Noh Tae Min 기자
  • 승인 2024.05.02 09:29
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Korean firm aiming to challenge Ajinomoto’s dominance
Image: TheElec
Image: TheElec

South Korean chemical giant LG Chem was testing its own build-up film with a potential flip-chip ball grid array (FC-BGA) customer, a company researcher said.

Builder-up films are an insulating film used in chip packages such as FC-BGA and glass substrates.

The industry mostly uses Ajinomoto Build-Up Film (ABF) for the process, the production of which is dominated by Ajinomoto.

Minyoung Lim, a researcher and a project leader for chip material at LG Chem, said during the 2024 Advanced Semiconductor Package Innovation Technology Conference, hosted by TheElec, the company was developing a build-up film, or BF, used in FC-BGA.

The customer testing the film is likely LG Group affiliate LG Innotek, which supplies chip packages to chipmakers.

LG Innotek is also expected to be able to leverage LG Chem’s BF supply to negotiate better prices when it comes to ABF.

BF supply overall is expected to increase as more chips become larger to pack in more features on them, an example of this being chiplets.

Meanwhile, Lim also said LG Chem was also developing back grinding tapes that are used in the wafer grinding process during chip production.

The tapes are attached to the front of the wafer from silicon dust and cleaning water while the back of the wafer is going through grinding.

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