Applied Materials and BE Semiconductor Industries (Besi) will collaborate in developing die-based hybrid boding equipment solution, the companies aid.
The two will collaborate in developing the co-development program as well as a Center of Excellence (COE) for the program.
The pair will each offer their competence in front-end and back-end for a combined hybrid boding solution, they said.
Applied Material’s etching, flattening, deposition, cleaning, measuring, inspecting process will be combined with Besi’s up-die placement, interconnect and assembly solutions.
The CEO will be located at Applied Material’s advanced packaging development center in Singapore. The center already has a class 10 cleanroom and a full line of wafer level packaging equipment.
Die-based hybrid bonding connects chips and the remaining architecture of high performance computing, artificial intelligence and 5G devices.