APS Holdings said on Tuesday that it has developed an OLED on silicon (OLEDoS) with a resolution of 3000pixels per inch (ppi).
The company developed an OLEDoS in 1000ppi earlier this year.
OLEDoS deposits OLED on a silicon wafer and are being developed for use in augmented and virtual reality devices.
APS Holdings’ OLEDoS uses RGB emission layers other companies developing OLEDoS also use white emission layers with RGB color filters.
The South Korean company has been developing fine metal masks (FMM) for the production of ultra-high resolution OLEDoS.
Its subsidiary APS Materials handle the deposition and encapsulation processes at a facility in Cheonan.
The company is developing FMM that uses laser patterning rather than the etching method that has already been commercialized.
APS Holdings had claimed in the past that there is a limit to how much resolution can be realized with etching.
The FMM used for the 3000ppi OLEDoS was made with invar just 8 micrometers thick, the company said.
This is much thinner than the FMM used to manufacture OLED used in QHD smartphones, which has a thickness of 18 micrometers, APS Holdings said.
APS Holdings is aiming to increase the resolution of the OLEDoS up to 4000ppi.
It is part of a government-backed project that is aiming to develop a prototype of a 4000ppi AR glass by 2024.