Inspection equipment maker TSI Korea has supplied its dual DDI bump pattern inspection equipment to LB Lusem.
TSI Korea CEO Lee Chul-hee told TheElec that this means it has supplied its equipment to the top two South Korean DDI chip on film makers, the other being STECO, which it began supplying in 2020.
TSI Korea was founded in 2017 when it spun out of display inspection equipment maker ANI.
TSI Korea specializes in inspection and measurement automation equipment for chips and displays.
The firm received financial support from ANI and the government-backed Korea Technology Finance Corporation when it was founded.
TSI Korea used these funds to develop its own auto visual inspection equipment, Lee said.
STECO is a subsidiary of Samsung that assembles chips and LB Lusem is a subsidiary of DDI maker LB Semicon, which split off from LG.
DDI, or display driver ICs, in TVs are attached during packaging in chip on film format.
TSI Korea’s auto visual inspection equipment is used when the chip on film is made.
Lee said the company’s equipment can find defects that are 3 micrometers in size and is used to check wafer-level pump patterns.
The equipment can autofocus at high speed in real-time for customers to react quickly to film warping.
It can inspect one chip per 1.25 seconds __ much faster than the previous 15 seconds.
TSI recorded 8 billion won in revenue last year and the company’s goal is to expand this to 30 billion won in five years, the CEO said.