UPDATED. 2024-07-19 07:49 (금)
SK Hynix gives HBM3E sample to customer
SK Hynix gives HBM3E sample to customer
  • 승인 2023.08.22 15:00
  • 댓글 0
이 기사를 공유합니다

Chipmaker continues to lead in the category
Image: SK Hynix
Image: SK Hynix

SK Hynix said on Monday that it has given a sample of its HBM3E to a customer.

High bandwidth memory connects DRAM vertically to increase their speed and is currently in high demand from AI applications.

HBM3E is an expansion of HBM3 with a further increased speed of 1.15TB per second.

The South Korean memory chip giant said it expects to start production of HBM3E in the first half of next year and lead in the AI memory market.

According to SK Hynix, it applied advanced MR-MUF in its latest memory chip. The process involves injecting liquid protective material between chips when they are vertically stacked.

The material is more heat and process efficient than film-type protective material and allowed HBM3E to be 10% more efficient in heat discharge.

HBM3E is also compatible with HBM3 systems and can be installed immediately, SK Hynix added.

The new chip is expected to be used in Nvidia’s GH200 GPU.

삭제한 댓글은 다시 복구할 수 없습니다.
그래도 삭제하시겠습니까?
댓글 0
계정을 선택하시면 로그인·계정인증을 통해
댓글을 남기실 수 있습니다.

  • 515, Nonhyeon-ro, Gangnam-gu, Seoul, Republic of Korea 4F, Ahsung Bldg.
  • 대표전화 : 82-2-2658-4707
  • 팩스 : 82-2-2659-4707
  • 청소년보호책임자 : Stan LEE
  • 법인명 : The Elec Inc.
  • 제호 : THE ELEC, Korea Electronics Industry Media
  • 등록번호 : 서울, 아05435
  • 등록일 : 2018-10-15
  • 발행일 : 2018-10-15
  • 발행인 : JY HAN
  • 편집인 : JY HAN
  • THE ELEC, Korea Electronics Industry Media Prohibiting unauthorized duplication,publishing,modification and distribution the material on this Site for any purpose.
  • Copyright © 2024 THE ELEC, Korea Electronics Industry Media. All rights reserved. mail to powerusr@thelec.kr