UPDATED. 2024-07-19 07:49 (금)
Solus supplies thin foil for memory chips to SK Hynix
Solus supplies thin foil for memory chips to SK Hynix
  • Gijong Lee
  • 승인 2023.09.26 20:58
  • 댓글 0
이 기사를 공유합니다

Korean firm enters market dominated by Mitsui
Image: Solus Advanced Materials
Image: Solus Advanced Materials

Solus Advanced Materials said on Monday that it has received approval for its thin foils from memory chip giant SK Hynix.

It will be the first case that a domestic copper foil company supplies such a product to SK Hynix.

The thin foils, which are ultra-thin at 2 micrometers, are aimed at use in a modified semi-additive process, a process used in the production of advanced chips.

The supply of thin foils used in chips is dominated by Japan’s Mitsui.

Solus Advanced Materials’ foils use technology from its European leg Volta Energy Solutions.

VES has over 60% market share in high-end copper foil with low loss and high spectrum, according to Solus Advanced Materials, and can make copper foils thinner than 1.5 micrometers.

Solus Advanced Materials will start production of the foils for SK Hynix during the first quarter of next year.

Meanwhile, the foil maker also supplies its ultra-thin foils to another global chip customer. It started production of the foils, which will be on logic chips, in May.

삭제한 댓글은 다시 복구할 수 없습니다.
그래도 삭제하시겠습니까?
댓글 0
계정을 선택하시면 로그인·계정인증을 통해
댓글을 남기실 수 있습니다.

  • 515, Nonhyeon-ro, Gangnam-gu, Seoul, Republic of Korea 4F, Ahsung Bldg.
  • 대표전화 : 82-2-2658-4707
  • 팩스 : 82-2-2659-4707
  • 청소년보호책임자 : Stan LEE
  • 법인명 : The Elec Inc.
  • 제호 : THE ELEC, Korea Electronics Industry Media
  • 등록번호 : 서울, 아05435
  • 등록일 : 2018-10-15
  • 발행일 : 2018-10-15
  • 발행인 : JY HAN
  • 편집인 : JY HAN
  • THE ELEC, Korea Electronics Industry Media Prohibiting unauthorized duplication,publishing,modification and distribution the material on this Site for any purpose.
  • Copyright © 2024 THE ELEC, Korea Electronics Industry Media. All rights reserved. mail to powerusr@thelec.kr