Samsung has ordered dozens of thermal compression (TC) bonders from its subsidiary Semes, TheElec has learned.
As TC bonders are used to stack DRAMs and a must to manufacture high bandwidth memory (HBM) and DDR5, the order indicates that Samsung will likely focus on advanced DRAM production this year.
This is because while memory chip prices have steadily climbed up again since late last year, the market is still in the recovery phase sources said.
Despite the downturn that lasted the past couple of years that caused all memory chip prices to drop, demand for advanced DRAM chips was steady from their use in servers and data centers.
However, demand for NAND is expected to continue to remain low this year.
Given the large order for TC bonders, Samsung is also expected to have placed orders for Syndion __ used for through silicon via etching __ and Damascene SABRE 3D made by Lam Research Both equipment are also used in the production of HBM.
Samsung and SK Hynix are preparing to expand their production capacity for 1a, 1b DRAM.