Samsung is aiming to become the world’s largest semiconductor company within two to three years, the company co-CEO said on Wednesday.
Samsung co-CEO Kyung Kye-hyun, who heads the company’s Device Solution (DS) division, its chip division, said during Samsung’s annual shareholders’ meeting the company also expected revenue from chip sales is expected to return to the same level as 2022, before the downturn.
Though Samsung is the world’s largest memory chipmaker, its combined revenue for all chips currently falls behind Intel.
Kyung said the memory business returned to the black in January and is expected to return to form this year.
Samsung is also facing criticism for seemingly falling behind in high bandwidth memory (HBM), which is in high demand from them being paired with AI chips, to rival SK Hynix.
The co-CEO said the company fell behind in preparation while the unfavorable market condition was also a factor.
Kyung said Samsung will recover its fundamental competitiveness to create a business that is less affected by market conditions. Besides HBM, the company was in talks with customers on compute express link (CXL) and processing in memory (PIM) products, and results on these areas will come out soon, he said.
Samsung Foundry president Siyoung Choi also said a competitor __ meaning Intel __ talked of a 1.4-nanometer (nm) process node but stressed that both Samsung and TSMC also have the node on their plan.
Customers want stable supply and product competitiveness from foundries, Choi said, and Samsung’s 4nm process node now has a mature yield rate.
The company’s Gen 2 3nm process node will go into production during the second half of the year and the 2nm process node next year, the president said.
