기사 (3건) 리스트형 웹진형 타일형 SK Hynix returns to profitability on back of HBM sales SK Hynix returns to profitability on back of HBM sales LB Semicon to reduce reliance on DDI LB Semicon to reduce reliance on DDI Samsung begins production of Gen 9 V-NAND with double stack structure Samsung begins production of Gen 9 V-NAND with double stack structure SK Hynix to use TSMC's base die for HBM4 SK Hynix to use TSMC's base die for HBM4 PSK clinches partial win over Lam Research in bevel etcher lawsuit PSK clinches partial win over Lam Research in bevel etcher lawsuit 3M aims to expand CMP pad revenue by 300% in 3 years 3M aims to expand CMP pad revenue by 300% in 3 years Tokyo Electron using HF gas instead of CF for cryo etching equipment Tokyo Electron using HF gas instead of CF for cryo etching equipment Samsung wins Nvidia’s 2.5D package order Samsung wins Nvidia’s 2.5D package order SK Hynix to spend US$3.87 billion to build chip packaging plant in Indiana SK Hynix to spend US$3.87 billion to build chip packaging plant in Indiana Sapeon to collaborate with TSMC partner Alphawave Semi on X430 AI chip Sapeon to collaborate with TSMC partner Alphawave Semi on X430 AI chip Samsung completes 16-stack HBM sample Samsung completes 16-stack HBM sample Samsung's new HBM development team to have 400 employees Samsung's new HBM development team to have 400 employees 처음처음1끝끝