THE ELEC, Korea Electronics Industry Media

기사 (1,034건)

[BATTERY] Nanotech Energy to manufacture ‘graphene’ battery using Korean firm

Stan Lee | 2024-09-11 07:41

[BATTERY] Samsung SDI to sell polarizing film unit to Chinese company

Stan Lee | 2024-09-11 07:41

[Semiconductor] NES Materials begins supplying sulfuric acid to Samsung

Noh Tae Min | 2024-09-03 19:15

[BATTERY] Woowon develops new prismatic battery assembly equipment

Stan Lee | 2024-09-03 11:28

[Semiconductor] Samsung testing Tokyo Electron’s GCB kit to improve EUV process

Noh Tae Min | 2024-09-03 11:28

[Semiconductor] SK Hynix develops 1c DDR5 DRAM ahead of Samsung

Noh Tae Min | 2024-08-29 19:07

[BATTERY] Lotte Energy Materials develop copper foil for solid-state battery

Stan Lee | 2024-08-28 08:47

[Display Panel] LG Display testing ways to make foldable panels thinner

Gijong Lee | 2024-08-28 08:46

[BATTERY] South Korean battery equipment makers invited to Morrow’s battery factory kickoff

Stan Lee | 2024-08-13 07:12

[Display Panel] Samsung Display to supply OLEDoS to Microsoft for MR device

JY Han | 2024-08-08 07:40

[BATTERY] DSK to supply notching equipment to Hyundai-LG battery joint venture

Stan Lee | 2024-08-06 07:21

[BATTERY] Avaco succeeds in electrode equipment supply to LG Energy

Stan Lee | 2024-08-02 11:09

[Display Panel] LG Chem expected to top Dupont in OLED evaporation material this year

Gijong Lee | 2024-08-01 07:15

[BATTERY] Vaisala visits Samsung SDI as battery maker looks to shift to chilled-mirror sensors

Stan Lee | 2024-07-25 07:35

[Semiconductor] Namhae Chemical’s subsidiary supplies sulfuric acid prototype to Samsung

Noh Tae Min | 2024-07-23 17:33

[BATTERY] EcoPro to make battery cell production line for research

Stan Lee | 2024-07-17 07:30

[Semiconductor] Samsung applies molybdenum in Gen 9 V-NAND

Noh Tae Min | 2024-07-02 22:02

[BATTERY] Yujin to enter battery equipment business

Stan Lee | 2024-07-01 17:15

[BATTERY] EcoPro BM in talks to supply sodium-ion battery cathode

Lee Min-Jo | 2024-06-21 07:28

[Semiconductor] 'Glass substrates to replace 2.5D package in chips in the future'

Noh Tae Min 기자 | 2024-06-11 19:20