APACT said on Friday that it will acquire ATsemicon’s packaging business unit.
The unit does semiconductor packaging and testing and APACT will take over the packaging part.
ATsemicon’s customers include SK Hynix and other fabless chip firms.
APACT recently built a second factory for packaging and is expanding in the sector.
The latest acquisition is at the MOU stage and APACT will determine the buying price after reviewing ATsemicon’s facilities.
Chip packaging is becoming more and more important in the semiconductor sector due to intense competition among chipmakers for microfabrication.
An APACT spokesperson said the company is aiming to offer packaging and testing as a turn-key solution for chipmakers and become an integrated outsourced semiconductor assembly and testing company.
