Samsung’s chip division has returned to profitability in the first quarter on the back of the recovery of the memory chip market.The South Korean electronics maker said on Tuesday that it recorded 71.92 trillion won in revenue and 6.61 trillion won in operating profit, an increase of 13% and 932%, r

South Korean chemical giant LG Chem was testing its own build-up film with a potential flip-chip ball grid array (FC-BGA) customer, a company researcher said.Builder-up films are an insulating film used in chip packages such as FC-BGA and glass substrates.The industry mostly uses Ajinomoto Build-Up

A national project to promote the development of advanced technologies in chip packaging has been passed by the South Korean government, TheElec has learned.It passed the preliminary feasibility review of Korea Institute of S&T Evaluation and Planning, a government think tank to set policies for sci

Samsung was considering applying metal oxide resist (MOR) during the extreme ultraviolet (EUV) lithography process for its next-generation DRAM, TheElec has learned.MOR is considered the next-generation photoresist (PR) to the chemically amplified resist (CAR) currently used in the lithography of ad

SK Hynix has beat market estimates on its latest earnings on the back of rising prices of memory chip prices and strong sales of high-bandwidth memory (HBM).The South Korean chip giant said on Thursday that it recorded 12.42 trillion won in revenue and 2.88 trillion won in operating income in the fi

South Korean chip assembly and test firm LB Semicon is aiming to reduce its reliance on display driver IC (DDI) for growth.LB Semicon vice president Kim Jeong-kyu told TheElec that last year was a time of reflection on what business areas it has invested in to plan where it wants to invest in the fu

Samsung said on Tuesday that it has begun mass production of 1Tb triple-level cell (TLC) Gen 9 V-NAND.The chip has a double stack structure, which is in contrast to rival SK Hynix’s Gen 9 V-NAND which is expected to have a triple stack structure.This means Samsung will have an advantage in cost whil

Battery and display production equipment maker Philoptics said on Tuesday that it has supplied a piece of laser equipment to a chipmaker’s trial line for use in the production of a glass substrate.The equipment, called Through Glass Via (TGV), based on laser, was supplied to the potential customer l

Samsung’s smartphone business is planning to use OLED on silicon (OLEDoS) from Sony for its extended reality (XR) device, TheElec has learned.Samsung MX Business’ decision to use the Japanese company’s technology over its affiliate Samsung Display, which has also been developing its own OLEDoS techn

SK Hynix is planning to use TSMC’s base die technology for its next-generation high bandwidth memory (HBM).The South Korean memory maker used its own process to make the base die for its latest HBM3E.For the follow-up HBM4, which will start mass production in 2026, SK Hynix will use TSMC’s advanced

Fab equipment maker PSK has succeeded in nullifying two out of three patents of Lam Research related to bevel etchers.South Korea’s highest court upheld an appellate court decision made last year that Lam Research's two patents were invalid.While the pair are fighting over another three patents at t

3M is aiming to quadruple its revenue from chemical mechanical polishing (CMP) pads by 300% in three years.Yang Yong-suk, technical supervisor of electronic material at 3M Korea, said during a local event hosted by the company said transistors in advanced nodes were going to nano-scale but results w

South Korea’s export of semiconductors climbed for the fifth consecutive month as of March.Total semiconductor exports hit US$11.69 billion in March, an increase of 33.9% from a year earlier, according to the Ministry of Science and ICT.Memory chips accounted for US$7.45 billion, with system chips a

“That promise has been kept,” Li Mei, the chairperson of Taiwan’s Fair Trade Commission, told the parliament in December of last year.They were responding to a question on whether US chip giant Qualcomm kept its promise to invest $700 million in the country.The company, known for its Snapdragon proc

Fab equipment maker Tokyo Electron’s cryo etching equipment is using hydrogen fluoride (HF).Etching is done to NAND to form the channel holes previously used carbon fluoride (CF).But with ultra-low temperature etching required for advanced NANDs (Gen 10 and up), the use of CF is expected to dramatic

Samsung has won Nvidia as a customer for 2.5D packaging, TheElec has learned.The company’s Advanced Package (AVP) team will be providing the interpose and I-Cube, its 2.5D package to the GPU maker, sources said.The high bandwidth memory (HBM) and the GPU wafer production will be handled by other com

SK Hynix said on Thursday that it will spend US$3.87 billion to build a chip packaging plant in Indiana state in the US.The plant will provide packaging services for memory chips aimed at AI applications.It will start shipping next-generation high bandwidth memory (HBM) in 2028.

AI chip firm Sapeon will collaborate with design house Alphawave Semi to develop its Gen 3 AI chip, X430, TheElec has learned.Sapeon signed a 59.6 billion won deal with the design house in February for the design service.X430, which will launch in 2026, will be made with TSMC’s 5-nanometer (nm) node

Display wet equipment maker FNS Tech is aiming to supply etching equipment for glass substrates aimed at chip packages, TheElec has learned.It is hoping to supply the kits to SKC Absolics, which is developing glass chip packages and building a dedicated factory in the state of Georgia in the US.FNS

Samsung said on Wednesday that it has manufactured a sample of a 16-stack high bandwidth memory (HBM).During a local conference hosted by The Korean Microelectronics and Packaging Society, Samsung vice president Kim Dae-woo said the tech giant manufactured the chip with hybrid bonding around a week